Our facilities

Factory facilities and production test equipment

A self-owned independent factory of 6,000 square meters, including 2,200 square meters of workshops, including 1,200 square meters of class 1,000/class 10,000 clean workshops.

10 automatic/manual probe stations, wafer cutting machine, automatic pick-up machine, automatic bonding machine, automatic placement machine, parallel sealing and welding machine, vacuum eutectic soldering furnace, tension/shear machine, X-ray machine , ultrasonic scanning SAT, coarse/fine leak detectors, PIND, microwave test instruments, a total of more than 300 sets

Ability to deliver 4 million bare chips and 500,000 ceramic package products per year

Packaging product production capacity

Features:

• Experienced design simulation capabilities
• Complete production equipment
• Possessing traditional packaging and advanced packaging production capabilities
• Automated production process

Packaging product inspection capabilities

Bare chip reliability testing

Features:

• According to GJB9001C and JEDEC standards
• 5‰ Random sampling test
• Temperature storage test
• Temperature cycle work test
• Temperature working test
• HOTL (high temperature operating life test)
• Power impact test (P6dB test)

Our standards